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Custom
HaoRui
01039
The end effector (ceramic robot hand) constitutes the end of the robot arm which handles and moves the semiconductor wafer between positions. It’s basically the robot’s hand so it is important that it be thermally and dimensionally stable and not contaminate the chamber with particles or chemical contaminants.
High purity alumina ceramic sintered body is used for the main body of end-effector, and porous ceramic is used for the wafer suction surface.
Compared with end-effectors that suction wafer by digging a ditch on the suction surface by approximately 1.5mm, the average micropore diameter of 20 µm can disperse suction pressure centering around the ditch. With this, Porous end-effector can hold thin wafer without deformation.
Customization & Machining Service
As a professional manufacturer of industrial ceramic components.We can custom the sepcial specifications of ceramic handling arm or other ceramic parts.High quality,Factory price, on-time delivery, High composition of ceramics
Alumina material Properties
Property | Item | 95% Al2O3 | 99% Al2O3 | 99.8%Al2O3 | Unit |
Mechanical Characteristics | Color | White | light yellow | Ivory | |
Bulk Density | 3.7 | 3.85 | 3.93 | g/cm3 | |
Water Absorption | 0 | 0 | 0 | % | |
Bending Strength | 300 | 310 | 370 | MPa | |
Compressive Trength | 2,300 | 2,400 | 2500 | MPa | |
Elastic Modulus | 320 | 340 | 390 | GPa | |
Fracture Toughness | 3~4 | 3~4 | 4 | MPa m1/2 | |
Weber Coefficient | 12 | 12 | 12 | m | |
Vickers Hardness | 1,400 | 1,600 | 1850 | HV 0.5 | |
Thermal Characterics | Coefficient of Line Thermal Expansion | 7~8 | 7~8 | 7~8 | 10-6 K-1 |
Thermal Conductivity | 20 | 29 | 32 | W/mK | |
Thermal Shock Resistance (Put in Water) | 250 | 200 | 280 | ΔT °C | |
Max Working Temperature | 1,500 | 1,600 | 1700 | °C | |
Electrical Characteristics | Volume Resistance At 20°C | >1014 | >1014 | >1014 | Ωcm |
Dielectric Strength | 15×106 | 15×106 | 15×106 | V/m | |
Dielectric Constant | 9 | 10 | 10 | εr | |
One MHZ Dielectric Loss Angle at 20°C | 0.0004 | 0.0002 | 0.0001 | tanδ | |
Chemical Characteristics | Nitric Acid (60%) 90°C | 0.1 | 0.1 | 0.05 | 24H WT Loss mg/cm2 |
Sulphuric Acid (95%) 95°C | 0.3 | 0.34 | 0.22 | ||
Caustic Soda (30%) 80°C | 0.9 | 0.95 | 0.04 |
The end effector (ceramic robot hand) constitutes the end of the robot arm which handles and moves the semiconductor wafer between positions. It’s basically the robot’s hand so it is important that it be thermally and dimensionally stable and not contaminate the chamber with particles or chemical contaminants.
High purity alumina ceramic sintered body is used for the main body of end-effector, and porous ceramic is used for the wafer suction surface.
Compared with end-effectors that suction wafer by digging a ditch on the suction surface by approximately 1.5mm, the average micropore diameter of 20 µm can disperse suction pressure centering around the ditch. With this, Porous end-effector can hold thin wafer without deformation.
Customization & Machining Service
As a professional manufacturer of industrial ceramic components.We can custom the sepcial specifications of ceramic handling arm or other ceramic parts.High quality,Factory price, on-time delivery, High composition of ceramics
Alumina material Properties
Property | Item | 95% Al2O3 | 99% Al2O3 | 99.8%Al2O3 | Unit |
Mechanical Characteristics | Color | White | light yellow | Ivory | |
Bulk Density | 3.7 | 3.85 | 3.93 | g/cm3 | |
Water Absorption | 0 | 0 | 0 | % | |
Bending Strength | 300 | 310 | 370 | MPa | |
Compressive Trength | 2,300 | 2,400 | 2500 | MPa | |
Elastic Modulus | 320 | 340 | 390 | GPa | |
Fracture Toughness | 3~4 | 3~4 | 4 | MPa m1/2 | |
Weber Coefficient | 12 | 12 | 12 | m | |
Vickers Hardness | 1,400 | 1,600 | 1850 | HV 0.5 | |
Thermal Characterics | Coefficient of Line Thermal Expansion | 7~8 | 7~8 | 7~8 | 10-6 K-1 |
Thermal Conductivity | 20 | 29 | 32 | W/mK | |
Thermal Shock Resistance (Put in Water) | 250 | 200 | 280 | ΔT °C | |
Max Working Temperature | 1,500 | 1,600 | 1700 | °C | |
Electrical Characteristics | Volume Resistance At 20°C | >1014 | >1014 | >1014 | Ωcm |
Dielectric Strength | 15×106 | 15×106 | 15×106 | V/m | |
Dielectric Constant | 9 | 10 | 10 | εr | |
One MHZ Dielectric Loss Angle at 20°C | 0.0004 | 0.0002 | 0.0001 | tanδ | |
Chemical Characteristics | Nitric Acid (60%) 90°C | 0.1 | 0.1 | 0.05 | 24H WT Loss mg/cm2 |
Sulphuric Acid (95%) 95°C | 0.3 | 0.34 | 0.22 | ||
Caustic Soda (30%) 80°C | 0.9 | 0.95 | 0.04 |
