Custom porous ceramic vacuum chucks & suction cups for wafer dicing, lapping, polishing and PV automation. Microporous alumina & SiC, 8"–12" or custom size, precision ground. OEM.

A porous ceramic vacuum chuck holds wafers and thin substrates by drawing vacuum through a microporous ceramic body, distributing holding force evenly across the part surface. Unlike grooved or pinned chucks, a microporous chuck supports the full backside of the workpiece, which reduces point-loading, vibration and edge chipping — critical for wafer dicing, back-grinding, lapping, cleaning and inspection.

Material selection is the first decision: porous alumina (Al2O3) offers stable chemical resistance and good rigidity for most wet and dry processes, while porous silicon carbide (SiC) suits high-temperature, high-wear or high-flow applications. Pore size, porosity and permeability must be matched to the workpiece, liquid flow, contamination risk and vacuum type — a "30 µm pore size" is a distribution characteristic, not a single hole diameter.

We machine microporous ceramic chucks, suction cups and multi-hole fixture plates in round, square and custom shapes, from standard 8"/12" wafer sizes to large-format and fully custom dimensions. Prototypes and OEM production are both supported: send your drawing or target size, and our engineers will confirm material, pore spec, flatness and tolerance before production.

FAQ

1. What materials are available for porous ceramic vacuum chucks? Porous alumina (Al2O3) and porous silicon carbide (SiC) are the standard options. Alumina suits most wet and dry wafer processes with good chemical stability; SiC is preferred for high-temperature, high-wear or high-flow applications. Other porous ceramics can be discussed for special requirements.

2. What pore sizes can you machine? Pore size is a distribution characteristic rather than an exact single-hole value. We produce chucks matched to your process — typical microporous grades are supplied as needed for wafer dicing, grinding, cleaning, lapping or polishing. Send your target pore size/porosity and we will confirm feasibility.

3. Can I get a custom size or shape? Yes. Round, square and non-standard shapes are available, from 8"/12" wafer sizes to large-format plates. Custom air-hole layouts and multi-hole fixture designs can be machined to your drawing.

4. Do you support prototyping and OEM? Yes. We support prototype-to-mass-production projects. Send your drawing, target size and vacuum requirements for a DFM review and quotation.