Custom porous ceramic vacuum chucks & suction cups for wafer dicing, lapping, polishing and PV automation. Microporous alumina & SiC, 8"–12" or custom size, precision ground. OEM.

A porous ceramic vacuum chuck holds wafers and thin substrates by drawing vacuum through a microporous ceramic body, distributing holding force evenly across the part surface. Unlike grooved or pinned chucks, a microporous chuck supports the full backside of the workpiece, which reduces point-loading, vibration and edge chipping — critical for wafer dicing, back-grinding, lapping, cleaning and inspection.

Material selection is the first decision: porous alumina (Al2O3) offers stable chemical resistance and good rigidity for most wet and dry processes, while porous silicon carbide (SiC) suits high-temperature, high-wear or high-flow applications. Pore size, porosity and permeability must be matched to the workpiece, liquid flow, contamination risk and vacuum type — a "30 µm pore size" is a distribution characteristic, not a single hole diameter.

We machine microporous ceramic chucks, suction cups and multi-hole fixture plates in round, square and custom shapes, from standard 8"/12" wafer sizes to large-format and fully custom dimensions. Prototypes and OEM production are both supported: send your drawing or target size, and our engineers will confirm material, pore spec, flatness and tolerance before production.