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| Quantity: | |
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07002
Application: | Refractory, Structure Ceramic, Industrial Ceramic, High Strength High Precision and Thermostability |
Material: | Aluminum Nitride Ceramic |
Type: | Ceramic Parts |
Transport Package: | Carton or Wooden Box for Safe Packing |
Specification: | Customized |
Trademark: | Customized |
Aluminum nitride has a series of excellent properties, the core advantages of which are excellent thermal conductivity,Reliable electrical insulation and thermal expansion coefficient matching that of silicon.
It is material for heat dissipation substrates and electronic device packaging, and can also be used for heat exchange，devices, piezoelectric ceramics and films, thermal conductive fillers, etc., with broad application prospects
Properties Of Aluminum Nitride Ceramics
| Item | Data | Unit |
| Color | Grey | - |
| Density | 3.30 | g/cm3 |
| Surface roughness Ra | 0.01~0.7 | um |
| Bending Strength | 450 | MPa |
| Moh's hardness | 8 | - |
| Thermal conductivity | 180 | 25°C，W/(m·k) |
| Coefficient of Thermal Expansion | 4 | 10-6/°C，100°C |
| Dielectric Constant | 8.8 | 1MHz |
| Dielectric loss | ＜3 | 1MHz，10-4 |
| Electrical Resistivity | >1014 | 25°C，Ω.cm |
| Dielectric strength | 17 | KV/mm |
Application: | Refractory, Structure Ceramic, Industrial Ceramic, High Strength High Precision and Thermostability |
Material: | Aluminum Nitride Ceramic |
Type: | Ceramic Parts |
Transport Package: | Carton or Wooden Box for Safe Packing |
Specification: | Customized |
Trademark: | Customized |
Aluminum nitride has a series of excellent properties, the core advantages of which are excellent thermal conductivity,Reliable electrical insulation and thermal expansion coefficient matching that of silicon.
It is material for heat dissipation substrates and electronic device packaging, and can also be used for heat exchange，devices, piezoelectric ceramics and films, thermal conductive fillers, etc., with broad application prospects
Properties Of Aluminum Nitride Ceramics
| Item | Data | Unit |
| Color | Grey | - |
| Density | 3.30 | g/cm3 |
| Surface roughness Ra | 0.01~0.7 | um |
| Bending Strength | 450 | MPa |
| Moh's hardness | 8 | - |
| Thermal conductivity | 180 | 25°C，W/(m·k) |
| Coefficient of Thermal Expansion | 4 | 10-6/°C，100°C |
| Dielectric Constant | 8.8 | 1MHz |
| Dielectric loss | ＜3 | 1MHz，10-4 |
| Electrical Resistivity | >1014 | 25°C，Ω.cm |
| Dielectric strength | 17 | KV/mm |
