 |
| Quantity: | |
|---|---|
0322
Material properties:
Silicon nitride (Si3N4) has an outstanding combination of material properties. It is extremely hard despite its low density, and due to its
The special crystal structure gives it excellent thermal stability and high fracture toughness. This makes it an excellent choice for use under extreme conditions. Therefore, silicon nitride ceramics are an excellent choice for high-speed and high-precision bearings, as well as an important material for high-temperature moulding, high-speed cutting tools and high-temperature wear-resistant parts.
Silicon Nitride Ceramic Roller
Silicon nitride (Si3N4) has an outstanding combination of material properties. It is extremely hard despite its low density and, because of the special crystal structure gives it excellent thermal stability and high fracture toughness. This makes it an excellent choice for use under extreme conditions. Therefore, silicon nitride ceramics are the best choice for high-speed and high-precision bearings, as well as important materials for high-temperature moulding, high-speed cutting tools and high-temperature wear-resistant parts.
Extremely high hardness (92.5HRA), excellent fracture toughness (6 ~ 7.0MPam1/2);
Good bending strength (850 MPa); very low density (3.20 g/cm3).
Very low coefficient of thermal expansion (3.2x10-6/K), maximum working temperature: 1400°C
 | Application industry: |
| Machinery, electronic, semiconductor, chemical, petroleum, smelt. |
| Specific application: |
| Welding shaft, electronic substrate, plunger, nozzle, slide guide, diesel parts, metal molding, shaft wheels etc. |
Properties Of Silicon Nitride
| Property | Item | Data | Unit |
Mechanical Characteristics | Color | Black/Grey | - |
| Density | 3.2 | g/cm3 | |
| Bending Strength | 750 | MPa | |
| Compressive Strength | 3800 | MPa | |
| Elastic Modulus | 290 | GPa | |
| Fracture Toughness | 7 | MPa m1/2 | |
| Weber Coefficient | 15 | m | |
| Vickers Hardness | 1700 | HV 0.5 | |
Thermal Characteristics | Coefficient of Line Thermal Expansion | 2 | 10-6 K-1 |
Thermal Conductivity | 20 | W/mK | |
Thermal Shock Resistance (Put in Water) | 750 | ΔT℃ | |
Max Working Temperature | 1300 | ℃ | |
Electrical Characteristics | Volume Resistance at 20℃ | >1014 | Ωcm |
Dielectric Strength | 10×106 | V/m | |
Dielectric Constant | - | εr | |
One MHZ Dielectric Loss Angle at 20℃ | - | tanδ | |
Chemical Characteristics | Nitric Acid(60%)90℃ | 1 | WT Loss mg/cm2/day |
Sulphuric Acid(95%)95℃ | ≒0.00 | ||
| Caustic Soda(30%)80℃ | 0.2 |
Main products:
Our company specializes in the production of zirconia ceramic precision parts, alumina ceramic precision parts, silicon nitride ceramic precision parts, silicon carbide ceramic precision parts, machinable ceramic precision parts, microporous ceramic precision parts, aluminium nitride ceramic precision parts, cemented carbide (tungsten steel) precision parts and so on.
The products are widely used in precision machinery manufacturing, microelectronics, semiconductor, aerospace, biomedicine, optical fibre communication, testing and inspection, solar photovoltaic and other fields.
Material properties:
Silicon nitride (Si3N4) has an outstanding combination of material properties. It is extremely hard despite its low density, and due to its
The special crystal structure gives it excellent thermal stability and high fracture toughness. This makes it an excellent choice for use under extreme conditions. Therefore, silicon nitride ceramics are an excellent choice for high-speed and high-precision bearings, as well as an important material for high-temperature moulding, high-speed cutting tools and high-temperature wear-resistant parts.
Silicon Nitride Ceramic Roller
Silicon nitride (Si3N4) has an outstanding combination of material properties. It is extremely hard despite its low density and, because of the special crystal structure gives it excellent thermal stability and high fracture toughness. This makes it an excellent choice for use under extreme conditions. Therefore, silicon nitride ceramics are the best choice for high-speed and high-precision bearings, as well as important materials for high-temperature moulding, high-speed cutting tools and high-temperature wear-resistant parts.
Extremely high hardness (92.5HRA), excellent fracture toughness (6 ~ 7.0MPam1/2);
Good bending strength (850 MPa); very low density (3.20 g/cm3).
Very low coefficient of thermal expansion (3.2x10-6/K), maximum working temperature: 1400°C
| Application industry: |
| Machinery, electronic, semiconductor, chemical, petroleum, smelt. |
| Specific application: |
| Welding shaft, electronic substrate, plunger, nozzle, slide guide, diesel parts, metal molding, shaft wheels etc. |
Properties Of Silicon Nitride
| Property | Item | Data | Unit |
Mechanical Characteristics | Color | Black/Grey | - |
| Density | 3.2 | g/cm3 | |
| Bending Strength | 750 | MPa | |
| Compressive Strength | 3800 | MPa | |
| Elastic Modulus | 290 | GPa | |
| Fracture Toughness | 7 | MPa m1/2 | |
| Weber Coefficient | 15 | m | |
| Vickers Hardness | 1700 | HV 0.5 | |
Thermal Characteristics | Coefficient of Line Thermal Expansion | 2 | 10-6 K-1 |
Thermal Conductivity | 20 | W/mK | |
Thermal Shock Resistance (Put in Water) | 750 | ΔT℃ | |
Max Working Temperature | 1300 | ℃ | |
Electrical Characteristics | Volume Resistance at 20℃ | >1014 | Ωcm |
Dielectric Strength | 10×106 | V/m | |
Dielectric Constant | - | εr | |
One MHZ Dielectric Loss Angle at 20℃ | - | tanδ | |
Chemical Characteristics | Nitric Acid(60%)90℃ | 1 | WT Loss mg/cm2/day |
Sulphuric Acid(95%)95℃ | ≒0.00 | ||
| Caustic Soda(30%)80℃ | 0.2 |
Main products:
Our company specializes in the production of zirconia ceramic precision parts, alumina ceramic precision parts, silicon nitride ceramic precision parts, silicon carbide ceramic precision parts, machinable ceramic precision parts, microporous ceramic precision parts, aluminium nitride ceramic precision parts, cemented carbide (tungsten steel) precision parts and so on.
The products are widely used in precision machinery manufacturing, microelectronics, semiconductor, aerospace, biomedicine, optical fibre communication, testing and inspection, solar photovoltaic and other fields.
