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Aluminum nitride ceramic disc /substrate with hole

Aluminum Nitride Substrate Features
-High thermal conductivity
-Low coefficient of thermal expansion
-Good electrical insulation and resistivity
-Low dielectric constant
-High mechanical strength under compression load
-Corrosion-resistant (gas)
-Good thermal shock resistance
  • 07009

Aluminum Nitride Ceramics substrate 

Aluminium nitride ceramic substrate as a new type of ceramic substrate, with high thermal conductivity, good mechanical properties, corrosion resistance, excellent electrical properties, can be welded, etc., is the ideal large-scale integrated circuit heat dissipation substrate and packaging materials

Properties Of Aluminum Nitride Ceramics

Surface roughness Ra0.01~0.7um
Bending Strength450MPa
Moh's hardness8-
Thermal conductivity18025°C,W/(m·k)
Coefficient of Thermal Expansion410-6/°C,100°C
Dielectric Constant8.81MHz
Dielectric loss<31MHz,10-4
Electrical Resistivity>101425°C,Ω.cm
Dielectric strength17KV/mm

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